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IC Package Storage Specified by IPC/JEDEC

Dry Box Storage Guideline as Recommended by IPC/JEDEC J-STD 033C
(Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Mount Devices.)

According to IPC/JEDEC J-STD 033C IC packages should be stored in a dry box capable of maintaining either 10%RH or 5%RH in order to prevent components from absorbing moisture.

・Storage in a cabinet below 5%RH: No limit in floor life.
Storage in a cabinet below 10%RH: Please see chart below for examples.
(Section of Table 7-1 from IPC/JEDEC J-STD 033C)

Package Type and
Body Thickness
Moisture
Sensitivity
Level

Floor life depending on humidity and temperature

Temperature
5%RH 10%RH 20%RH 30%RH 40%RH 50%RH 60%RH 70%RH 80%RH 90%RH
Body Thickness > 3.1mm
including
PQFPs >84 pins,
PLCCs (square)
All MQFPs
or
All BGAs > 1mm
2a





94
124
167
231
44
60
78
103
32
41
53
69
26
33
42
57
16
28
36
47
7
10
14
19
5
7
10
13
4
6
8
10
←35ºC
←30ºC
←25ºC
←20ºC
3





8
10
13
17
7
9
11
14
6
8
10
13
6
7
9
12
6
7
9
12
4
5
7
10
3
4
6
8
3
4
5
7
←35ºC
←30ºC
←25ºC
←20ºC
4


3
5
6
8

3
4
5
7

3
4
5
7

2
4
5
7
2
3
5
7

2
3
4
6

2
3
3
5

1
2
3
4

1
2
3
4

←35ºC
←30ºC
←25ºC
←20ºC
5


2
4
5
7
2
3
5
7
2
3
4
6
2
2
4
5
1
2
3
5
1
2
3
4
1
2
2
3
1
1
2
3
1
1
2
3
←35ºC
←30ºC
←25ºC
←20ºC
5a


1
2
3
5
1
1
2
4
1
1
2
3
1
1
2
3
1
1
2
3
1
1
2
2
1
1
1
2
1
1
1
2
1
1
1
2
←35ºC
←30ºC
←25ºC
←20ºC


Resetting the Floor Life

Level 2.2a.3

Under IPC-JEDEC-J-STD-033C, the floor life of IC packages that have been removed from their moisture barrier bags is reset using the benchmarks given below.

Level Outside air conditions at exposure Reset humidity Floor life reset
2 30°C 60% RH or below Storage cabinet with an internal humidity of 10% RH or less Where the exposure time is 12 hours or less, the time required for reset is 5 times the exposure time.
2a
3






Resetting the Floor Life

Level 4.5.5a

Level Outside air conditions at exposure Reset humidity Floor life reset
4 30°C 60% RH or below Storage cabinet with an internal humidity of 5% RH or less Where the exposure time is 8 hours or less, the time required for reset is 10 times the exposure time.
5
5a


Low-temperature low-humidity baking (example) IPC/JEDEC J-STD-033C

(The floor life can be reset at a temperature of 40°C and a humidity of 5% RH or less)

IC package thickness Level Baking humidity at 40℃ ≤5%RH
Thickness ≤ 1.4 mm
  Exposure time after floor life has elapsed > 72 hr  Exposure time after floor life has elapsed ≤ 72 hr 
2 8 days 5 days
2a 9 days 7 days
3 13 days 9 days
4 15 days 9 days
5 17 days 10 days
5a 22 days 10 days
Thickness >1.4 mm ≤ 7.0 mm 2 25 days 20 days
2a 29 days 22 days
3 37 days 23 days
4 47 days 28 days
5 57 days 35 days
5a 79 days 56 days

Because IC packages with tape reels and LEDs cannot be baked at high temperatures, the values for low-temperature, low-humidity baking are set according to IPC/JEDEC (40°C, 5% RH). This is also ideal for baking other electronic components that cannot be baked at high temperatures.

Low-temperature, low-humidity baking according to IPC/JEDEC

Low-temperature, low-humidity baking according to IPC/JEDEC
Low-temperature, low-humidity baking cabinet	300 l MB-301 (5% RH)
Low-temperature, low-humidity baking cabinet	1200 l MB-1001 (5% RH)



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